| 固体继电器受热载荷作用的数值模拟分析 |
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| 引用本文： | 崔芮华,常国梅,王丽娟,王志成,陈子顺.固体继电器受热载荷作用的数值模拟分析[J].低压电器,2007(15):9-11. |
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| 作者姓名： | 崔芮华 常国梅 王丽娟 王志成 陈子顺 |
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| 作者单位： | 河北工业大学,天津,300130 |
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| 摘 要： | 针对固体继电器受热问题,基于热弹性力学理论建立了三维有限元数值模拟分析模型。研究了固体继电器在功率耗散情况下,受热载荷作用时的温度分布和热应力分布,并通过对不同参数下温度和热应力的模拟,初步分析了影响固体继电器热性能的各设计因素。所得的计算结果可为产品的改进提供依据。
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| 关 键 词： | 固体继电器 有限元 温度场 热应力 |
| 文章编号： | 1001-5531(2007)15-0009-03 |
| 修稿时间： | 2006年11月16 |
Numerical Simulation Analysis of Solid State Relay Subjected to Thermal Loading |
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| CUI Ruihua,CHANG Guomei,WANG Lijuan,WANG Zhicheng,CHEN Zishun.Numerical Simulation Analysis of Solid State Relay Subjected to Thermal Loading[J].Low Voltage Apparatus,2007(15):9-11. |
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| Authors: | CUI Ruihua CHANG Guomei WANG Lijuan WANG Zhicheng CHEN Zishun |
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| Abstract: | Based on the theory of thermo-elasticity mechanics, the 3-D finite element numerical simulation model was established for a solid state relay (SSR) subjected to thermal loading. The distribution of temperature and thermal-stress under power dissipation using thermal loading were studied, and every factor that influences the thermal function of SSR was preliminarily analyzed by simulating the temperature and thermal-stress under different parameters. The result can provide basis for the improvement of this product. |
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| Keywords: | solid state relay (SSR) finite element temperature field thermal-stress |
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