Au-Cu-Ni 合金在铜基材表面的无氰电镀

采用亚硫酸盐体系在铜基材表面进行Au-Cu-Ni合金的电镀,研究了镀液中铜、镍浓度与镀层成分的关系。结果表明,镀液中铜、镍浓度较高时,Au-Cu-Ni合金镀层中的铜、镍含量也会增加。用金、铜和镍浓度分别为20、0.7和3.5 g/L的镀液电镀得到的Au-10.35Cu-2.50Ni合金镀层显微硬度(HV0.025)达到297,电阻率1.84,镀层光亮致密,耐腐蚀性好。镀层磨损量小,接触电阻变化值小且稳定,可满足高导电要求的滑动电连接器件的要求。

Non-Cyanide Electroplating of Gold-Copper-Nickel Alloy on Surface of Copper Base

The sulfite system was used to electroplating Au-Cu-Ni alloy on the surface of copper base materials. The relationship between the concentration of copper and nickel in the plating bath and the composition of the coating was studied. The results showed that the concentration of copper and nickel in the Au-Cu-Ni alloy coating increases with their concentrations in the plating bath. When the concentration of gold, copper and nickel is 20, 0.7 and 3.5 g/L, respectively, the obtained Au-10.35Cu-2.50Ni alloy coating had a microhardness (HV0.025) of 297 and a resistivity of 1.84. The coating was bright and dense, and it had good corrosion resistance. The wear amount is small, and the variation of contact resistance is small, so the coating can meet the requirements of high conductivity sliding electrical connector.