射频系统封装的发展现状和影响

电子产品小型化将进一步依赖微电子封装技术的进步.SiP（系统封装）所强调的是将一个尽可能完整的电子系统或子系统高密度地集成于单个封装体内,随着其技术的研究不断深入,封装规模不断扩大,其作用不断提升,它在射频领域中的应用特性也日趋突出,成为实现视频系统小型化、轻量化、高性能和高可靠的有效方法.针对当前RF SiP（射频系...

Developing Situation and Influence for Radio-frequency of System in Package Technology

The miniaturization process of electronic products will further depend on the micro-electronic packaging technology. SiP （system in package） emphasizes that it integrates an entire electronic system or subsystem into a package. As the SiP technology research going deeply, packaging scale enlarges and takes affect continuously, its characteristic applied in RF （radio-frequency） realm also becomes better and better day by day. A SiP technology is a effective method to realize miniaturization, lightweight, high performance and high reliability of radio-frequency system. Aiming at the hot topic of the RF SiP development, review the developing situation of RF SiP at home and abroad in recent years, and analyze the influence of RF SiE The electrical characteristics of RF SiP are described and the methods for structure improvement are discussed, which relate to silicon-based substrate, low temperature co-fired ceramic substrate, multi-layer organic substrate and so on. The review can give reference for packaging industry to counter with RF SiP.