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On the etching mechanism of ZrO2 thin films in inductively coupled BCl3/Ar plasma
Authors:Mansu Kim  Sun Jin Yun  Alexander Efremov
Affiliation:a Department of Control and Instrumentation Engineering, Korea University, Jochiwon, Chungnam 339-700, South Korea
b Electronics and Telecommunications Research Institute, 161 Gajung-dong, Yusong-gu, Daejon 305-350, South Korea
c Department of Computer and Applied Physics, Hanseo University, Haemi-myun, Seosan-City, Chungnam 356-706, South Korea
d Department of Electronic Devices and Materials Technology, State University of Chemistry and Technology, 7 F.Engels St., 153000 Ivanovo, Russia
Abstract:The etching mechanism of ZrO2 thin films in BCl3/Ar plasma was investigated using a combination of experimental and modeling methods. It was found that an increase in the Ar mixing ratio causes the non-monotonic behavior of the ZrO2 etch rate which reaches a maximum of 41.4 nm/min at about 30-35% Ar. Langmuir probe measurements and plasma modeling indicated the noticeable influence of a BCl3/Ar mixture composition on plasma parameters and active species kinetics that results in non-linear changes of both densities and fluxes for Cl, BCl2 and View the MathML source. From the model-based analysis of surface kinetics, it was shown that the non-monotonic behavior of the ZrO2 etch rate can be associated with the concurrence of chemical and physical pathways in ion-assisted chemical reaction.
Keywords:ZrO2  Etch rate  Dissociation  Ionization  Etch mechanism  BCl3/Ar plasma modeling
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