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Nano-scale metallization of Au on flexible polyimide substrate by reversal imprint and lift-off process |
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| Authors: | Henry J.H. Chen Chenhsin Lien Shou-Ren Chen |
| Affiliation: | a Department of Electrical Engineering, National Chi Nan University, Puli Township, Nantou, Taiwan b Institute of Electronics Engineering, National Tsing Hua University, 101, Section 2, Kuang-Fu Road, Hsinchu 30013, Taiwan c Mechanical and System Research Laboratories, Industrial Technology Research Institute, ITRI, Hsinchu, Taiwan |
| Abstract: | The nano-scale metallization of Au on flexible polyimide substrate by reversal imprint and lift-off process was investigated. The nano-scale mold was fabricated; the anti-adhesion property of nanometer-size Si-mold was improved and the surface free energy was calculated with the contact angle measurement. The ∼150 nm width Au nano-wires were successfully fabricated on Si and on flexible polyimide substrate with the proposed process. The PMMA thickness dependent trend with reversal imprinting and Au nano-wires lift-off results were also investigated by SEM analysis. |
| Keywords: | Nano-scale Au Polyimide Reversal imprint Lift-off |
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