Experimental observations on nonlinear phenomena in transducer assembly for thermosonic Flip-Chip bonding |
| |
Authors: | Lei Han Jue Zhong |
| |
Affiliation: | College of Mechanical and Electrical Engineering, Central South University, Changsha 410083, China |
| |
Abstract: | Dynamical characteristics of PZT actuated transducer assembly are the key to reliable flip-chip bonding and basic understanding of metal interconnection. A systematic experimental observations and analysis clearly exhibit that, rich phenomena and effects like the negative cubic stiffness, dynamical coupling between transducer body and tool, velocity dropping and anomalous phase portrait of the die movement, may be explained by nonlinear features and non-parallel loading of transducer assembly onto its bonding area. It will be possible to explore their mechanism and effects to bonding quality by identifying and decoding them. |
| |
Keywords: | PZT transducer assembly Nonlinear dynamics Thermosonic bonding Flip-chip die Laser vibrometer |
本文献已被 ScienceDirect 等数据库收录! |
|