| 浅析影响电解铜箔抗剥离强度的因素及对策 |
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| 引用本文： | 黄芳恩. 浅析影响电解铜箔抗剥离强度的因素及对策[J]. 铜业工程, 2009, 0(4): 55-57 |
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| 作者姓名： | 黄芳恩 |
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| 作者单位： | 江铜-耶兹铜箔有限公司,江西,南昌,330034 |
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| 摘 要： | 该文对电解铜箔生产过程中影响抗剥离强度的原因进行了分析,重点分析了生箔、表处粗化层、硅烷对抗剥离强度的影响。
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| 关 键 词： | 生箔 表处粗化层 硅烷 |
An Analysis of Electrodeposited Copper Foil Peel Strength Performance Factors & Solutions |
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| HUANG Fang-en. An Analysis of Electrodeposited Copper Foil Peel Strength Performance Factors & Solutions[J]. Copper Engineering, 2009, 0(4): 55-57 |
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| Authors: | HUANG Fang-en |
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| Affiliation: | HUANG Fang - en ( JCC- Yates Copper Foil Inc. ,Nanchang 330034 ,Jiangxi,China) |
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| Abstract: | Through a serious of sedulous investigation, tests and analysis, the company found some measures to improve the peel strength of electrodeposited copper foil under a consistent production condition. Also in this paper the author focuses on the sections of key factors concerning ED raw foil structure, treatment layers formation and silane. |
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| Keywords: | ED Raw Foil Treatment layers Silane |
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