Thermal conductivity of diamond/copper composites with a bimodal distribution of diamond particle sizes prepared by pressure infiltration method |
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Authors: | Chao Chen Hong Guo Ke Chu Fazhang Yin Ximing Zhang Yuanyuan Han Yeming Fan |
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Affiliation: | The General Research Institute of Nonferrous Metals Beijing, Beijing 100088, China |
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Abstract: | The thermal conductivity of diamond/copper composites with bimodal particle sizes was studied. The composites were prepared
through pressure infiltration of liquid copper into diamond preforms with a mixture of 40 and 100 μm-size diamonds. The permeability
of the preforms with different coarse-to-fine volume ratios of diamonds was investigated. The thermal conductivity of the
diamond/copper composites with bimodal size distribution was compared to the theoretical value derived from an analytical
model developed by Chu. It is predicted that the diamond/copper composites could reach a higher thermal conductivity and their
surface roughness could be improved by applying bimodal diamond particle sizes. |
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Keywords: | metallic matrix composites thermal conductivity diamonds copper size distribution pressure infiltration |
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