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生物质中温热熔预浸料用环氧树脂体系
引用本文:张旭锋,余金光,韦家虎,益小苏.生物质中温热熔预浸料用环氧树脂体系[J].材料工程,2017,45(4).
作者姓名:张旭锋  余金光  韦家虎  益小苏
作者单位:1. 北京航空材料研究院,北京,100095;2. 中航复材(北京)科技有限公司,北京,101300;3. 北京航空材料研究院,北京 100095;中航复材(北京)科技有限公司,北京101300
摘    要:采用生物质松香酸酐固化剂,通过配方设计和筛选,由配方体系成膜性、胶膜储存期、胶膜状态及DSC测试初步确定生物质环氧树脂体系的配方组成环氧树脂/固化剂/促进剂的质量比为100/60/3~4。由动态/稳态DSC测试和锥板旋转黏度计对体系的固化特征温度和黏度-温度-时间特性进行研究,结果确定树脂体系可在120~140℃完成固化,热熔法预浸温度范围60~85℃,其黏度在1500~5000mPa·s,其中70℃操作时间达180min。最后由红外光谱和DSC对生物质环氧体系的固化反应机理进行了研究。

关 键 词:生物质  环氧树脂  中温固化  热熔预浸

Bio-based Epoxy Resin System for Hot-melt Prepreg Curing at Mid-temperature
ZHANG Xu-feng,YU Jin-guang,WEI Jia-hu,YI Xiao-su.Bio-based Epoxy Resin System for Hot-melt Prepreg Curing at Mid-temperature[J].Journal of Materials Engineering,2017,45(4).
Authors:ZHANG Xu-feng  YU Jin-guang  WEI Jia-hu  YI Xiao-su
Abstract:A novel bio-based epoxy resin system with rosin-sourced acid anhydrides was established by formula design and selection according to the resin film's forming performance and state with different storage time.The formula involves epoxy resin/curing agent/accelerator with mass proportion of 100/60/3-4.The curing property and the relationship between viscosity-temperature-time of resin were characterized by dynamic or steady state DSC analysis and cone plate viscometer, respectively.The results show the resin system can be cured at the range of 120-140℃, and the range of hot melt prepreg temperature is 60-85℃ with the viscosity from 1500mPa·s to 5000mPa·s.The processing time of hot melt prepreg is about 180min at 70℃.The curing mechanism of bio-based resin was also investigated through the samples with different curing time by IF and DSC.
Keywords:bio-based  epoxy resin  cure at mid-temperature  hot-melt prepreg
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