首页 | 本学科首页   官方微博 | 高级检索  
     

微细间距引线键合中的可靠性提高工艺
作者单位:KuLicke & Sofia, USA
摘    要:在引线键合期间,工艺可靠性在整个的器件组装成本中扮演着一个重要角色。可靠性可以认为是引线键合机在规定条件和限定时间之内完成其符合要求的所需功能的或然率。由于键合故障、键合机部件装配零件问题、封装类型和不完全的工艺窗口导致了频繁的键合中断,可以导致除干扰工厂运行计划和产品质量之外的成品率降低和引线键合工艺中的停工。经过2年时间的研究,我们识别了在毛细管性能特性与键合故障之间的密切联系,提出了提高工艺可靠性的几点改进。

关 键 词:引线键合  可靠性  键合故障  薄形四侧引脚扁平封装  球栅阵列封装测试  产率

Increasing Process Reliability in Fine-Pitch Wire Bonding
Yair Alcobi. Increasing Process Reliability in Fine-Pitch Wire Bonding[J]. Equipment for Electronic Products Marufacturing, 2008, 37(12)
Authors:Yair Alcobi
Affiliation:KuLicke & Soffa, USA
Abstract:During wire bonding,process reliability plays an important role in overall device assemblycost.Reliability refers to the probability that a wire bonder will perform its required functionssatisfactorily under specific conditions and within a certain time period.Frequent bonding interruptionsdue tO bonding failures,bonder subassembly parts problems,package type and an inadequate processwindow can lead to lower yields and downtime in the wire bonding process in addition to disturbingfactory operations planning and product quality.A 2-year study identifies close ties between capillaryperformance and bonding failures.
Keywords:Wire Bonding  Reliability  Bonding Failures  LQFP  BGA Test
本文献已被 维普 万方数据 等数据库收录!
设为首页 | 免责声明 | 关于勤云 | 加入收藏

Copyright©北京勤云科技发展有限公司  京ICP备09084417号