热超声倒装键合机的视觉系统定位精度实验研究

简要说明了视觉定位原理及定位实验数据的采集过程,并对倒装键合实验台的视觉定位系统的误差进行了理论分析。以热超声倒装键合实验台为平台,应用HexSight图像处理软件,对实验用1mm×1mm的表面有8个凸点的芯片进行定位实验。根据测得的实验结果,分别对定位系统的平移误差和旋转误差进行了分析。采用对5次识别结果取平均值的优化方法,使角度误差减小到0.023766°,单项误差减小到0.183μm,综合误差减小到0.554μm。试验结果表明,该视觉定位系统达到了热超声倒装键合过程中芯片与基板之间的定位精度的要求。

Experimental research on the positioning accuracy of the vision system in the thermosonic flip-chip bonderflip chip bonder

This paper explains the theory of vision position and the procedure of the data acquisition, and analyses the error of the vision system theoretically.Based on the thermosonic flip-chip bonder test stand, the positioning experiment is carried out on the scale 1mm ×1mm chips with 8 bumps with the HexSight software.According to the experiment results, the error of translation and rotation of the vision positioning system are analyzed separately.Finally applying the method of averaging the five-sequential recogni tion error results, the angle error of this vision positioning system was reduced to 0.023 766° , the single position error of the vision system was reduced to 0.183μm, the composite position error of the vision system was reduced to 0.554μm.