| 高速PCB 信号完整性仿真与分析 |
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| 引用本文： | 张成刚,李,斌,王六春.高速PCB 信号完整性仿真与分析[J].微波学报,2012,28(S2):359-360. |
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| 作者姓名： | 张成刚 李 斌 王六春 |
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| 作者单位： | 南京电子技术研究所, 南京 210039 |
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| 摘 要： | 针对如何能缩短电路设计开发流程和提高设计人员工作效率，本文主要提出了如何有效解决信号完整性问题。
介绍了一种信号完整性分析的方法，使用IBIS 模型进行信号完整性分析，通过加载芯片的IBIS 模型对高速PCB 板进行
仿真，并对仿真结果进行优化分析，达到验证设计的目的。
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| 关 键 词： | 信号完整性 IBIS 模型 |
Simulation and Analysis of High-Speed PCB |
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| ZHANG Cheng-gang,LI Bin,WANG Liu-chun.Simulation and Analysis of High-Speed PCB[J].Journal of Microwaves,2012,28(S2):359-360. |
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| Authors: | ZHANG Cheng-gang LI Bin WANG Liu-chun |
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| Abstract: | Aimed how to shorten the research procedure of electrical circuit,and how to improve work efficiency of designers.
This paper presents how to efficiently solute the problem of Signal Integrity. A method is presented to analyze the signal integrity.
IBIS model of IC is selected to the board level signal integrity analysis. The PCB signals are simulated by using IBIS model. The
result can be optimised and simulation results could testify the design specification. |
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| Keywords: | signal integrity IBIS model |
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