X 波段四通道MMCM 基板设计

低温共烧陶瓷（LTCC）是制作微波多芯片组件（MMCM）基板的理想材料。本文介绍了基于LTCC 工艺的微 波传输线、集成腔体、功分器和散热过孔的设计。对于多通道微波组件，采用带状传输线和腔体结构有利于实现通道 间的高隔离度，集成功分器和浆料电阻有利于实现组件的小型化并可获得较好的微波性能，而矩阵散热过孔可以显著 改善基板导热性能，满足小功耗器件的散热要求。

Design of X-band Four-channel MMCM Substrate

Low Temperature Co-fired Ceramic (LTCC) is widely applied as substrate in microwave multi-chip module (MMCM). Designing of microwave transmission lines, integrated cavity, power divider and heat dissipation via based on LTCC process is discussed in the paper. In MMCM, strip transmission line and cavity structure is good for high isolation between channels, integrated power divider and paste resistor is good for module miniaturization and microwave performance, while thermal conductivity performance of LTCC substrate can be improved observably by using matrix vias, which meet the demand of heat dissipation of small power devices.