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有机硅低聚体合成工艺
引用本文:杨锐,曹端林,李永祥. 有机硅低聚体合成工艺[J]. 应用化工, 2006, 35(12): 943-945
作者姓名:杨锐  曹端林  李永祥
作者单位:中北大学,化工与环境学院,山西,太原,030051
摘    要:采用一甲基三乙氧基硅烷、二甲基二乙氧基硅烷、一苯基三乙氧基硅烷未完全水解制备了含乙氧基的有机硅低聚体。通过正交实验分析确定最佳工艺条件为,原料配比R/S i=1.4,Ph/R=0.2,反应时间为2.5 h,反应温度为80℃。对最佳工艺条件下的有机硅低聚体进行红外光谱表征,低聚体剪切强度可达2.92 MPa。

关 键 词:一甲基三乙氧基硅烷  二甲基二乙氧基硅烷  一苯基三乙氧基硅烷  合成
文章编号:1671-3206(2006)12-0943-03
收稿时间:2006-08-24
修稿时间:2006-08-24

Synthetic craft of organosilyl low-molecular polymer
YANG Rui,CAO Duan-lin,LI Yong-xiang. Synthetic craft of organosilyl low-molecular polymer[J]. Applied chemical industry, 2006, 35(12): 943-945
Authors:YANG Rui  CAO Duan-lin  LI Yong-xiang
Affiliation:Chemical Industry and Environment Institute of North University of China,Taiyuan 030051, China
Abstract:Organosilyl low-molecular polymer was synthesized by methltriethoxysilone,diethoxydimethlsilane,phenyltriethoxysilane.The process was optimized by orthogonal experiment and a better synthetic condition was obtained.The results showed that react 2.5 h at 80℃ and the materials ratio is R/Si=1.4,Ph/R=0.2.The polymer performed well prepared under the optimum condition,the product was characterized by IR,and the shear strength can reach 2.92 MPa.
Keywords:methltriethoxysilone  diethoxydimethlsilane  phenyltriethoxysilane  synthetic
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