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Preparation of Cu-Ni Film Resistors with Low Resistivity and Low TCR |
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| Authors: | Masami Ishikawa Hidehiko Enomoto Naohiro Mikamoto Tsuneshi Nakamura Hidemi Nawafune Takashi Uegaki |
| Affiliation: | 1. Osaka Municipal Technical Research Institute, Morinomiya, Joto-ku, Osaka 536-8553 (Japan);2. Matsushita Electronic Components Co., Ltd., Kadoma, Osaka 571-8506 (Japan);3. Konan University, Okamoto, Higashinadaku, Kobe 658-8501 (Japan) |
| Abstract: | Thin film resistors with low TCR and low electric resistivity were prepared from phosphorus free Cu-Ni alloy obtained by electroless and electrolytic deposition with heat treatment at low temperature. |
| Keywords: | copper-nickel alloy pyrophosphate-tetraborate bath electrodeposition electroless-deposition specific resistance TCR (temperature coefficient of resistance) |