| 化学镀法制备铜银双金属粉及其抗氧化性研究 |
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| 引用本文： | 余凤斌,刘贞,陈莹.化学镀法制备铜银双金属粉及其抗氧化性研究[J].电工材料,2010(1):23-25. |
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| 作者姓名： | 余凤斌 刘贞 陈莹 |
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| 作者单位： | 1. 山东天诺光电材料有限公司,济南,250101
2. 中国兵器工业新技术推广研究所,北京,100089 |
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| 基金项目： | 国防基础科研(B0920061337) |
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| 摘 要： | 导电填料是电子产品用导电涂料的主要组成部分,为防止银填料中Ag的迁移及克服Cu的易氧化缺点,本文采用置换法与还原剂还原相结合的方法制备了镀银铜粉,研究了AgNO3浓度、搅拌速度、EDTA二钠盐浓度及后处理对镀银铜粉抗氧化性的影响。结果表明,随AgNO3浓度的增大、搅拌速度的加快以及EDTA二钠盐用量的增加,镀银铜粉的抗氧化性均呈先增加后逐步减弱的趋势。采用硬脂酸甘油酯等混合溶液进行后处理可以提高产品的抗氧化性。
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| 关 键 词： | 化学镀 镀银铜粉 抗氧化 |
Preparation of Cu-Ag Bimetallic Powder by Electroless Plating and its Oxidation Resistance Research |
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| YU Feng-bin,LIU Zhen,CHEN Ying.Preparation of Cu-Ag Bimetallic Powder by Electroless Plating and its Oxidation Resistance Research[J].Electrical Engineering Materials,2010(1):23-25. |
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| Authors: | YU Feng-bin LIU Zhen CHEN Ying |
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| Affiliation: | 1.Shan Dong Tiannuo Photoelectric material Co.Ltd;Jinan 250101;China;2.Advanced Technology Generalization Institute of China Ordnance Industries;Beijing 100089;China |
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| Abstract: | The conductive filling is a main component of conductive coating composite for electronics.In order to prevent the migration of Ag and overcome the oxidization of Cu powders,displacement method combined reduction was used to prepare Cu-Ag bimetallic powder.Research the effect of AgNO3 concentration,stirring speed,EDTA disodium salt and post-processing on the antioxidant of silver-plated copper powder.The results show that with increasing the AgNO3 concentration,accelerating stirring speed and increasing the... |
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| Keywords: | electroless plating silver-plated copper powder oxidation resistance |
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