| 计算机芯片散热技术的最新研究进展及其评价 |
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| 引用本文： | 代丹. 计算机芯片散热技术的最新研究进展及其评价[J]. 现代计算机, 2014, 0(8): 26-30 |
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| 作者姓名： | 代丹 |
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| 作者单位： | 中国航空规划建设发展有限公司工程技术研究院,北京100120 |
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| 摘 要： | 近年来，随着计算机芯片功耗和工作温度的飙升，计算机芯片散热技术成为研究的热点，各种各样的计算机芯片冷却方法和设备也像雨后春笋般蓬勃地发展起来。在分析当前计算机芯片发展趋势、芯片散热需求和芯片散热技术研究趋势的基础上，从传统和新兴两方面对典型的芯片冷却技术进行详尽的评述，并对这些技术和方法未来的研究方向和发展前景进行展望。
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| 关 键 词： | 计算机芯片 冷却技术 芯片封装 |
Latest Research Advancement and Evaluation of Computer Chip Cooling Technology |
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| DAI Dan. Latest Research Advancement and Evaluation of Computer Chip Cooling Technology[J]. Modem Computer, 2014, 0(8): 26-30 |
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| Authors: | DAI Dan |
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| Affiliation: | DAI Dan (Engineering ＆ Technology Research Institute, China Aviation Planning and Construction Development Co., Ltd., Beijing 100120) |
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| Abstract: | In recent years, along with the computer chip power consumption and working temperature soared, computer chip cooling technology has become a research hot spot, so a lot of chip-cooling technology developed as the mushrooming. Based on the analysis of the current de-velopment trend of computer chip, chip cooling demand and chip cooling technology research trends, summarizes both the traditional and current chip-cooling technology, makes a certain outlook for the future development for these methods and technologies. |
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| Keywords: | Computer Chip Cooling Technology Chip Package |
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