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Failure mechanism models for electromigration
Authors:Young  D Christou  A
Affiliation:Maryland Univ., College Park, MD;
Abstract:This tutorial illustrates situations where electromigration (a wearout failure mechanism) in electronic devices can degrade performance. Electromigration and its relation to microstructure is discussed. Temperature considerations are treated. A practical model for electromigration and two application examples of it are given. Qualitative design procedures for avoiding solid-state electromigration failure are briefly discussed
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