Stress Relaxation in Peel Adhesion |
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| Authors: | Gary R Hamed |
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| Affiliation: |
a Institute of Polymer Science, University of Akron, Akron, Ohio, U.S.A. |
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| Abstract: | The peeling of an adhesive joint consisting of an SBS copolymer and two Mylar film substrates proceeds by cohesive rubber rupture, and the strength increases with test rate. Stress relaxation during peeling is shown to account for this behavior and relaxation data after peeling is used to predict the rate dependence of the peel force. |
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