| 用于HDI的新型感光抗蚀材料与图形转移技术 |
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| 引用本文： | 刘晓阳,朱斌,张良静. 用于HDI的新型感光抗蚀材料与图形转移技术[J]. 印制电路信息, 2007, 0(11): 22-28 |
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| 作者姓名： | 刘晓阳 朱斌 张良静 |
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| 作者单位： | 江南计算技术研究所,江苏无锡,214083 |
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| 摘 要： | 随着高密度互连(HDI)技术的发展,IC封装密度的提高,高解析度(分辨率)、均一性良好的超薄感光抗蚀膜成为必然需求,文中介绍了电沉积技术(ED)成膜的方法、原理以及相应的图形转移技术,并与传统干膜、旋涂成膜工艺进行对比,结果表明ED膜具有良好的粘附力、很高解析度以及精确的图形精度。
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| 关 键 词： | 高密度互连(HDI) IC封装 感光抗蚀材料 光刻技术 电沉积 图形转移 解析度 |
| 文章编号： | 1009-0096(2007)11-0022-07 |
A New Type Photoresist and Pattern Transfer Technology for HDI |
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| Liu Xiaoyang,Zhu Bin,Zhang Liangjing. A New Type Photoresist and Pattern Transfer Technology for HDI[J]. Printed Circuit Information, 2007, 0(11): 22-28 |
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| Authors: | Liu Xiaoyang Zhu Bin Zhang Liangjing |
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| Affiliation: | Liu Xiaoyang Zhu Bin Zhang Liangjing |
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| Abstract: | With the development of High Density Interconnection(HDI) Technology, and the packaging of IC improving, the ultra-thin film with high resolution and favourable uniformity is required. In the thesis, the method and principle of getting electro deposition (ED) photoresist has been introduced, together with the technology of pattern transfer. And then compared with traditional dry film and spin coated liquid, the result shows that the ED film has more predominant performance in adhesion, resolution and pattern accuracy. |
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| Keywords: | High Density Interconncetion (HDI) IC Packaging photoresist lithography technology Electro Deposition (ED) pattern transfer resolution |
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