| 抗有机杂质添加剂对镀镍溶液整平性能的影响 |
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| 引用本文： | 夏绍春,左正忠.抗有机杂质添加剂对镀镍溶液整平性能的影响[J].电镀与涂饰,1996,15(4):7-10. |
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| 作者姓名： | 夏绍春 左正忠 |
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| 作者单位： | 武汉大学化学系 |
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| 摘 要： | 研究了镀镍液几种有机添加剂的整平性能，发现添加剂的整平能力同其阴极极化能力密切相关。只有增大阴极极化的添加剂才有可能起到整平作用。抗有机杂质添加剂一般减小极化，故只具有负整平作用。
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| 关 键 词： | 镀镍 整平性 镀液 有机杂质 助剂 电镀 |
Effects of Anti-Organic Impurity Additives on Leveling Power of Nickel Plating Solution |
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| XIA Shaochun,ZUO Zhengzhong.Effects of Anti-Organic Impurity Additives on Leveling Power of Nickel Plating Solution[J].Electroplating & Finishing,1996,15(4):7-10. |
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| Authors: | XIA Shaochun ZUO Zhengzhong |
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| Affiliation: | XIA Shaochun;ZUO Zhengzhong |
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| Abstract: | Leveling efficiencies of several organic additives in nickel plating bath are studied.The results show that leveling abilities of additives are in close relationship with their influences on cathodic polarization. Only those additives which can make cathodic polarization increased really have leveling performance. Anti-organic impurity additives make cathodic polarization decreased, so they lead to negative leveling. |
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| Keywords: | nickel plating leveling power anti-organic impurity additive |
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