| 磁控溅射技术制备二氧化钛薄膜研究进展 |
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| 引用本文： | 王博,魏世丞,王玉江,郭蕾,梁义,潘复生,徐滨士.磁控溅射技术制备二氧化钛薄膜研究进展[J].表面技术,2018,47(8):257-264. |
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| 作者姓名： | 王博 魏世丞 王玉江 郭蕾 梁义 潘复生 徐滨士 |
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| 作者单位： | 陆军装甲兵学院装备再制造技术国防科技重点实验室;重庆大学材料科学与工程学院 |
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| 基金项目： | 国家自然科学基金面上项目（5167052643）；中国工程院咨询研究项目（2017-XY-37）；“十三五”装备预研共用技术项目 （404010205） |
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| 摘 要： | 磁控溅射技术具有溅射速率高、膜基结合力好、易实现工业化生产等技术优势,在二氧化钛薄膜制备方面具有显著优势,但磁控溅射参数对二氧化钛薄膜结构和性能的影响显著,如何通过控制和优化磁控溅射参数,获得高性能二氧化钛薄膜已成为目前的研究热点。概述了不同晶型二氧化钛的结构特点、物理性质和磁控溅射制备二氧化钛薄膜的工作原理,指出成膜过程中的溅射功率、溅射气压、溅射时间、沉积温度和氧分压等是影响薄膜结构和性能的主要因素,并详细阐述了上述五种工艺参数对二氧化钛薄膜沉积速率、膜层厚度、表面粗糙度、相组成和光催化性能等的影响规律和作用机制。此外,还对其他影响薄膜结构和性能的关键因素及影响规律进行了介绍,包括退火温度对膜层组织转变影响的规律,金属元素掺杂和非金属元素掺杂对膜层形貌和性能的影响,以及不同溅射靶材特点及其对成膜过程的影响。最后提出未来磁控溅射技术制备二氧化钛薄膜的研究难点,并对二氧化钛薄膜的下一步研究方向进行了展望。
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| 关 键 词： | 二氧化钛薄膜 工艺参数 磁控溅射 组织 金红石 锐钛矿 性能 |
| 收稿时间： | 2018/3/7 0:00:00 |
| 修稿时间： | 2018/8/20 0:00:00 |
Titanium-oxide Thin Films Prepared by Magnetron Sputtering Method |
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| WANG Bo,WEI Shi-cheng,WANG Yu-jiang,GUO Lei,LIANG Yi,PAN Fu-sheng and XU Bin-shi.Titanium-oxide Thin Films Prepared by Magnetron Sputtering Method[J].Surface Technology,2018,47(8):257-264. |
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| Authors: | WANG Bo WEI Shi-cheng WANG Yu-jiang GUO Lei LIANG Yi PAN Fu-sheng and XU Bin-shi |
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| Affiliation: | 1.National Key Laboratory for Remanufacturing, Academy of Armored Forces Engineering, Beijing 100072, China,1.National Key Laboratory for Remanufacturing, Academy of Armored Forces Engineering, Beijing 100072, China,1.National Key Laboratory for Remanufacturing, Academy of Armored Forces Engineering, Beijing 100072, China,1.National Key Laboratory for Remanufacturing, Academy of Armored Forces Engineering, Beijing 100072, China,1.National Key Laboratory for Remanufacturing, Academy of Armored Forces Engineering, Beijing 100072, China,2.School of Material Science and Engineering, Chongqing University, Chongqing 400044, China and 1.National Key Laboratory for Remanufacturing, Academy of Armored Forces Engineering, Beijing 100072, China |
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| Abstract: | Magnetron sputtering technology presents obvious advantages in preparing TiO2 films due to its higher sputtering rate, better film-substrate adhesion, easier industrial processes applicable to mass-production-scale deposition. However, structure and properties of TiO2 films can be significantly affected by magnetron sputtering parameters. Nowadays, how to control and optimize the parameters to achieve high performance TiO2 has become current research focus. Therefore, this work provided an overview of structure features and physical property of TiO2 in different crystal forms, and working principle of preparing TiO2 by magnetron sputtering. It was indicated that sputtering power, sputtering pressure, sputtering time, deposition temperature, oxygen partial pressure, etc. in the process of film formation were main factors affecting structure and properties of the films. In addition, the work elaborated the laws of influence and function of the five above-mentioned technological parameters on deposition rate, film thickness, surface roughness, phase composition, and photo catalytic properties. Besides, other key influencing factors and influence law affecting the structure and properties of TiO2 were also introduced, such as law of influence of annealing temperature on film structural transformation, effects of metal and non-metal doping on film morphology and properties, and different sputtering target material characteristics and their effects on film formation process. Finally, future research difficulties in developing TiO2 films by magnetron sputtering were proposed, and future research fields of TiO2 films were predicted. |
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| Keywords: | titanium-oxide film technological parameters magnetron sputtering microstructure rutile anatase properties |
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