| CVD Diamond Sink Application in High Power 3D MCMs |
| |
| 引用本文： | XIE Kuo-jun JIANG Chang-shun LI Cheng-yue. CVD Diamond Sink Application in High Power 3D MCMs[J]. 中国电子科技, 2005, 3(3): 268-271 |
| |
| 作者姓名： | XIE Kuo-jun JIANG Chang-shun LI Cheng-yue |
| |
| 作者单位： | [1]School of Physic Electronics, University of Electronic Science and Technology of China, Chengdu 610054 China |
| |
| 基金项目： | National Natural Science Foundation of China （No.60371006）. |
| |
| 摘 要： | As electronic packages become more compact, run at faster speeds and dissipate more heat, package designers need more effective thermal management materials. CVD diamond, because of its high thermal conductivity, low dielectric loss and its great mechanical strength, is an excellent material for three dimensional （319） multichip modules （MCMs） in the next generation compact high speed computers and high power microwave components. In this paper, we have synthesized a large area freestanding diamond films and substrates, and polished diamond substrates, which make MCMs diamond film sink becomes a reality.
|
| 关 键 词： | CVD 金刚石膜 酶化作用 3D多片模型 |
| 收稿时间： | 2005-01-18 |
CVD Diamond Sink Application in High Power 3D MCMs |
| |
| XIE Kuo-jun,JIANG Chang-shun,LI Cheng-yue. CVD Diamond Sink Application in High Power 3D MCMs[J]. Journal of Electronic Science Technology of China, 2005, 3(3): 268-271 |
| |
| Authors: | XIE Kuo-jun JIANG Chang-shun LI Cheng-yue |
| |
| Abstract: | As electronic packages become more compact, run at faster speeds and dissipate more heat, package designers need more effective thermal management materials. CVD diamond, because of its high thermal conductivity, low dielectric loss and its great mechanical strength, is an excellent material for three dimensional (3D) multichip modules (MCMs) in the next generation compact high speed computers and high power microwave components. In this paper, we have synthesized a large area freestanding diamond films and substrates, and polished diamond substrates, which make MCMs diamond film sink becomes a reality. |
| |
| Keywords: | diamond film substrate sink 3D multichip modules |
| 本文献已被 CNKI 维普 万方数据 等数据库收录！ |
