|
|||||
|
|
Heat transfer study of submicro-encapsulated PCM plate for food packaging application |
|
| Affiliation: | 1. Irstea, UR GPAN, 1 rue Pierre-Gilles de Gennes, CS 10030, 92761 Antony, France;2. Novel Materials and Nanotechnology Group, Institute of Agrochemistry and Food Technology (IATA-CSIC), Avda, Agustin Escardino 7, 46980 Paterna Valencia, Spain;3. National Technical University of Athens, School of Chemical Engineering, Athens, Greece;1. School of Energy and Power Engineering, Zhengzhou University of Light Industry, Zhengzhou, Henan 450002, China;2. School of Food and Biological Engineering, Zhengzhou University of Light Industry, Zhengzhou, Henan 450002, China;3. Collaborative Innovation Center of Food Production and Safety of Henan Province, Henan 450002, China |
| Abstract: | In recent studies, encapsulated phase change materials (PCM) were developed as novel materials for food packaging because of their improved thermal insulation capacity. The PCMs (often liquid in room temperature) are encapsulated in a shell material so as they can be practically handled. In this work, the thermal behaviour of an encapsulated PCM material (Rubitherm RT5 encapsulated in polycaprolactone PCL) with two different PCM mass fractions was studied. The model was validated by experimental cooling and heating processes, under controlled air temperature conditions. The numerical result demonstrated a better thermal buffering capacity of the encapsulated PCM material compared to a standard one (cardboard). |
| Keywords: | Heat transfer Thermal properties Encapsulation Phase change material (PCM) Transfert de chaleur Propriétés thermiques Encapsulation Matériau à changement de phase (PCM) |
| 本文献已被 ScienceDirect 等数据库收录！ | |