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Precise mechanical polishing of brittle materials with free diamond abrasives dispersed in micro–nano-bubble water
Affiliation:1. V. N. Bakul Institute for Superhard Materials, National Academy of Sciences of Ukraine, vul. Avtozavods''ka 2, Kiev 04074, Ukraine;2. Ammosov Northeast Federal University, Republic Sakha (Yakutiya), ul. Belinskogo 28, Yakutsk 677000, Republic Sakha, Russian Federation;1. Institute of Nanoscience and Nanotechnology, NCSR “Demokritos”, Terma Patriarchou Grigoriou and Neapoleos, Attica, Greece;2. Inorganic Chemistry Laboratory, Chemistry Department, National and Kapodistrian University of Athens, Zografou, Greece;3. Hephaestus Advanced Laboratory, Department of Chemistry, International Hellenic University, Kavala, Greece
Abstract:We have studied the effects of using water containing micro–nano-bubbles (MNB water) as the solution in which the diamond abrasives with a mean diameter of 0.5 μm are dispersed for the polishing slurry used in the precise mechanical polishing (PMP) of brittle material of GaN. While the formation of small number of clusters of abrasives was seen in the MNB water, the abrasives were basically well dispersed, which were almost comparable to that in pure water with a dispersion agent such as ethylene glycol. Since flocculation was observed for dispersion in pure-water without the addition of the dispersion agent, it was found that MNBs have dispersion effect for micro-sized abrasive particles. Regarding the polishing properties of GaN substrate with the MNB water based polishing slurry, we observed a remarkable increase in the removal rate with no additional surface or subsurface degradation. Additionally, we observed a significantly reduced subsurface damage (SSD) for chemically weak N-face of GaN substrate. It was suggested that these observed effects were most probably a result of the cluster formation in the MNB water and the chemical effect in relation to high energy generation through bubble collapse, respectively.
Keywords:Micro–nano bubbles  Mechanical polishing  Brittle materials  Diamond abrasive  Removal rate  Subsurface damage
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