A novel method for micro-gap control in electrogenerated chemical polishing |
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| Affiliation: | 1. Center for Plasma and Laser Engineering, The Szewalski Institute of Fluid Flow Machinery, Polish Academy of Sciences, Fiszera 14, Gdansk 80-231, Poland;2. Department of Physics of Electronic Phenomena, Faculty of Applied Physics and Mathematics, Gdansk University of Technology, Narutowicza 11/12, Gdansk 80-233, Poland;3. Department of Chemistry and Technology of Functional Materials, Chemical Faculty, Gdansk University of Technology, Narutowicza 11/12, Gdansk 80-233, Poland;1. Institute of Computer Information Management, Inner Mongolia University of Finance and Economics, Hohhot 010070, China;2. Department of Mathematics, Inner Mongolia University of Technology, Hohhot 010051, China |
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| Abstract: | In the electrogenerated chemical polishing (EGCP), material removal rate (MRR) is inversely proportional to the processing gap. To polish a workpiece with a large area, high and uniform MRR is necessary, which prefers a small and uniform processing gap. Based on the principle of the hydrostatic support, a novel micro-gap control method is proposed. The method uniformly controls the gap between the electrode and workpiece to a micro level over a large area. A relationship between the gap size and the inlet pressure is derived theoretically and verified experimentally. The proposed method is successfully applied to the polishing of a Cu surface with a diameter of 50 mm. Promising results are obtained that surface roughness and flatness are reduced from average roughness (Ra) 82 nm and peak-to-valley (PV) value 290 nm to Ra 4 nm and PV 120 nm, respectively. |
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| Keywords: | Micro-scale gap Hydrostatic support Electrogenerated chemical polishing Roughness Flatness |
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