| 金属外壳引线键合可靠性研究 |
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| 引用本文： | 张崎,姚莉. 金属外壳引线键合可靠性研究[J]. 电子与封装, 2009, 9(3): 27-31 |
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| 作者姓名： | 张崎 姚莉 |
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| 作者单位： | 中国电子科技集团公司第43研究所,合肥,230043;中国电子科技集团公司第43研究所,合肥,230043 |
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| 摘 要： | 引线键合以工艺简单、成本低廉、适合多种封装形式的优势,在连接方式中占主导地位。其中把内部电路与金属外壳内引线柱之间的连接称为引线键合,目前90%以上的封装管脚采用引线键合连接。引线键合强度和可靠性不仅与键合工艺有关（比如键合工艺参数、键合设备、操作技能等因素）,而且与外壳引线的镀覆结构、镀层厚度、内引线柱高度等因素密切相关。文章简要介绍了引线键合工艺的基本原理,通过试验分析并比较了金属外壳镀覆结构、镀层厚度、内引线柱高度对键合可靠性的影响,提出了优化键合可靠性的外壳设计原则。
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| 关 键 词： | 金属外壳 引线键合 镀层厚度 可靠性 |
Research of Reliability for Metal Package's Wire Bonding |
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| ZHANG Qi,YAO Li. Research of Reliability for Metal Package's Wire Bonding[J]. Electronics & Packaging, 2009, 9(3): 27-31 |
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| Authors: | ZHANG Qi YAO Li |
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| Affiliation: | ZHANG Qi,YAO Li (China Eletronics Technology Group Corporation No.43 Research Institute,Hefei 230043,China) |
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| Abstract: | Wire bonding is a dominant method among bonding modes,which is featured for its simple technics,low cost and suitable for many types of sealing modes. Wire bonding is to connect interior circuits with lead pins of metal packages together. At present,90% of all package pins adopt wire bonding method. The strength and reliability of wire bonding ia not only closely related to parameter of bonding technology,bonding equipments or operational skills,but also tightly related to plating layer structure and thickn... |
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| Keywords: | metal package wire bonding plating thickness reliability |
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