Impact of interface microstructure on adhesion force between silver paste and silicon solar cells’ emitter

The adhesion strength between silver paste and silicon solar cell’s emitter is a primary source of long-term degradation in solar modules. In this study, the interface microstructure between screen-printed silver thick-film and silicon solar cells’ emitter was studied. Three kinds of commercial silver pastes were printed on silicon solar cells’ emitter to form different Ag–Si contact structures. The interface microstructure between silver paste and emitter was observed by SEM, while the compositions of Ag thick-film were analyzed by EDX. The deductions we got from SEM and EDX were verified by the pull test for the first time. The results presented in this study give some suggestions to the development of silver paste and crystalline silicon solar cells’ fire-through.