| HDI板RCC料层孔壁爆裂原因分析和改善 |
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| 引用本文： | 胡吉山. HDI板RCC料层孔壁爆裂原因分析和改善[J]. 印制电路信息, 2005, 0(5): 37-41 |
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| 作者姓名： | 胡吉山 |
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| 作者单位： | 至卓飞高线路板(深圳)有限公司,518067 |
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| 摘 要： | 分析了HDI板生产中RCC料层出现孔壁爆裂的原因,同时给出了改善方法,并对此原因和改善方法进行了验证。
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| 关 键 词： | 高密度互连 涂树脂铜箔 玻璃化温度 盲孔 通孔 孔壁爆裂 |
The Root Cause Analysis and Improvement Action on Hole Wall Crack Defect at RCC Position for HDI PCB |
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| Hu Jishan. The Root Cause Analysis and Improvement Action on Hole Wall Crack Defect at RCC Position for HDI PCB[J]. Printed Circuit Information, 2005, 0(5): 37-41 |
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| Authors: | Hu Jishan |
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| Abstract: | The paper show that one root cause of hole wall crack defect on HDI PCB, and verify this result by a series of experiment. And also the detail improvement actions are provided respectively for this defect. |
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| Keywords: | HDI RCC Tg blind hole through hole hole wall crack |
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