Effect of plating parameters on the properties of pulse electrodeposited Ni–TiN thin films |
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| Affiliation: | 1. Graduate Institute of Precision Engineering, National Chung Hsing University, Taichung 402, Taiwan, ROC;2. Biomedical Instrument Technology Division, Instrument Technology Research Center, Hsinchu 302, Taiwan, ROC;1. College of Mechanical and Electrical Engineering, Nanjing University of Aeronautics and Astronautics, 210016 Nanjing, China;2. Beijing Institute of Space Mechanic & Electricity, 100080 Beijing, China |
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| Abstract: | The influence of pulse plating parameters on the microstructure, microhardness, and properties of the Ni–TiN thin films was investigated by transmission electron microscopy (TEM), atomic force microscopy (AFM), X–ray diffraction (XRD), scanning electron microscopy (SEM), and corrosion and wear tests. The results indicated the Ni–TiN thin films prepared via electrodeposition at 4 A/dm2 current density to show an optimum microhardness and TiN content values of 984.7 HV and 8.69 wt%, respectively. The average grain sizes of Ni and TiN in the films obtained at 200 Hz were 127.8 and 48.5 nm, respectively. Numerous large pores can be noticed in the films prepared at pulse frequencies of 200 Hz and 500 Hz, whereas only a few small pits are visible on the surface of the Ni–TiN thin films deposited at 800 Hz. The films prepared at 20% duty cycle experienced the least weight loss. |
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| Keywords: | Effect Ni–TiN thin film Plating parameter Structure Property |
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