Fabrication and thermal conductivity of highly porous alumina body from platelets with yeast fungi as a pore forming agent |
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| Affiliation: | 1. The State Key Laboratory of Refractories and Metallurgy, Wuhan University of Science and Technology, Wuhan 430081, China;2. Institute of Thermal Engineering, School of Energy and Power Engineering, Dalian University of Technology, Dalian 116024, China;3. Technical University Bergakademie Freiberg, Institute for Ceramic, Glass, and Construction Materials, Agricolastraße 17, 09596 Freiberg, Germany;1. School of Material Science and Engineering, China University of Mining and Technology, Xuzhou 221116, China;2. Division of Materials Science, Luleå University of Technology, Luleå 971 87, Sweden;3. Department of Chemistry, University of Liverpool, Liverpool L69 7ZD, UK;1. School of Materials Science and Engineering, North University of China, Taiyuan 030051, China;2. State Key Lab of New Ceramics and Fine Processing, School of Materials Science and Engineering, Tsinghua University, Beijing 100084, China;1. State Key Laboratory of Multi-phase Complex Systems, Institute of Process Engineering, Chinese Academy of Sciences, Beijing 100190, China;2. University of Chinese Academy of Sciences, No. 19A Yuquan Road, Beijing 100049, China;3. CAS Center for Excellence in Urban Atmospheric Environment, Xiamen 361021, China |
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| Abstract: | A highly porous alumina body was fabricated by heating a green clinker body consisting of platelets and yeast fungi as a pore forming agent. Four kinds of alumina platelets were used. When green clinker bodies of platelet aggregates (A11) with 10 and 30 mass% of yeast fungi were heated at 1500 °C for 2 h, their porosities reached 72% and 78%, respectively. In contrast, when the green clinker bodies composed of platelets with an average size of 10 µm and an aspect ratio of 25–30 (SERATH①), and 20 mass% of yeast fungi were heated at 1400 °C for 2 h, the porosity of the resultant porous alumina body was also approximately 72%. However, the room temperature thermal conductivities of the porous alumina bodies with 72% porosity derived from A11 and SERATH① were 0.86 and 0.50 W m?1 K?1, respectively. The decrease in the thermal conductivity of the porous alumina body produced from SERATH① is caused by the long path route for heat transfer. |
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| Keywords: | Porous alumina Yeast fungi Alumina platelet Thermal conductivity Card house structure |
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