| 氧化铜室温下机械还原的研究 |
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| 引用本文： | 马学鸣,岳兰平,董远达.氧化铜室温下机械还原的研究[J].金属学报,1991,27(6):76-78. |
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| 作者姓名： | 马学鸣 岳兰平 董远达 |
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| 作者单位： | 中国科学院固体物理研究所，中国科学院固体物理研究所，中国科学院固体物理研究所 助理研究员 |
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| 基金项目： | 国家自然科学基金资助课题 |
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| 摘 要： | 本文研究了室温下氧化铜用金属镁作还原剂的机械还原.电镜和X射线衍射结果都表明,室温下球磨32h后,CuO基本被还原.还原后晶粒细化到平均尺寸小于20nm,由此提出了机械力驱动下,纳米级界面激活的机械还原机制。
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| 关 键 词： | 氧化铜 机械还原 铜 镁 |
| 收稿时间： | 1991-06-18 |
| 修稿时间： | 1991-06-18 |
MECHANICAL REDUCTION OF CuO AT ROOM TEMPERATURE BY Mg |
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| MA Xueming,YUE Lanping,DONG Yuanda Institute of Solid State Physics,Academia Sinica,Hefei.MECHANICAL REDUCTION OF CuO AT ROOM TEMPERATURE BY Mg[J].Acta Metallurgica Sinica,1991,27(6):76-78. |
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| Authors: | MA Xueming YUE Lanping DONG Yuanda Institute of Solid State Physics Academia Sinica Hefei |
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| Abstract: | The mechanical reduction of CuO by pure metallic Mg has been investigated during pulverizing in ball mill at room temperature. The reduction was towards its completion of an average particle size down to 20nm after 32h. The mechanism of mechanical reduction of oxide seems to be proposed as the surface activation of nm sized particles driven by mechanical force. |
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| Keywords: | CuO Cu mechanical reduction Mg |
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