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氮化硅陶瓷球研磨去除方式
引用本文:张珂,王定文,李颂华,孙健,吴玉厚. 氮化硅陶瓷球研磨去除方式[J]. 金刚石与磨料磨具工程, 2019, 39(3): 38-44. DOI: 10.13394/j.cnki.jgszz.2019.3.0007
作者姓名:张珂  王定文  李颂华  孙健  吴玉厚
作者单位:沈阳建筑大学 机械工程学院,沈阳,110168;沈阳建筑大学 机械工程学院,沈阳 110168;沈阳建筑大学,高档石材数控加工装备与技术国家地方联合工程实验室,沈阳 110168;沈阳建筑大学,高档石材数控加工装备与技术国家地方联合工程实验室,沈阳 110168
基金项目:高等学校学科创新引智计划(D18017)。国家自然科学基金项目( 51675353)“双百工程”计划(Z18-5-023)
摘    要:为研究研磨工艺参数对氮化硅陶瓷球表面材料去除机理及表面质量的影响,采用立式研球机,通过改变研磨盘转速和压力对氮化硅陶瓷球进行研磨试验,利用扫描电镜、超景深三维显微镜检测研磨后陶瓷球的表面形貌,并运用ABAQUS进行有限元模拟,分析研磨过程中氮化硅陶瓷球表面材料的去除方式及表面质量。研究表明:研磨盘转速和压力对研磨过程中陶瓷球表面材料的去除方式、表面缺陷和表面质量影响较大,随着研磨盘转速和压力的减小,其表面划伤、凹坑和雪花等缺陷明显减少,表面质量随之提高;当压力较大、研磨盘转速较高时,材料以二体断裂去除为主;当压力较小、研磨盘转速较低时,材料以三体脆性断裂去除为主;与二体断裂去除相比,三体脆性断裂去除产生的亚表面裂纹更深。 

关 键 词:氮化硅  有限元仿真  表面质量  材料去除方式

Material removal mode of lapping Si3N4balls
ZHANG Ke,WANG Dingwen,LI Songhua,SUN Jian,WU Yuhou. Material removal mode of lapping Si3N4balls[J]. Diamond & Abrasives Engineering, 2019, 39(3): 38-44. DOI: 10.13394/j.cnki.jgszz.2019.3.0007
Authors:ZHANG Ke  WANG Dingwen  LI Songhua  SUN Jian  WU Yuhou
Affiliation:1. School of Mechanical Engineering, Shenyang Jianzhu University, Shenyang 110168, China;2. National-Local Joint Engineering Laboratory of NC Machining Equipment and Technology of High-Grade Stone, Shenyang Jianzhu University, Shenyang 110168, China
Abstract:To explore the effect of grinding parameters on surface quality and the mechanism of material removal mode in lapping process, lapping experiment on Si3N4 bearing balls was carried out by vertical grinder. And the lapping process was designed according to different speeds of lapping panel and lapping pressure. The surface morphology was examined using SEM and 3D optical microscopy and the FEM simulation was combined to analyze the material removal mode and the surface quality in the grinding process. The results indicate that the speed of lapping panel and the lapping pressure have great influence on the removal mode, surface defect and surface quality of ceramic balls during lapping. With the decrease of speed of lapping panel and pressure, the surface defects such as scratches, pits and snowflakes are obviously reduced, and the surface quality is improved accordingly. The material removal mode is mainly 2-body abrasion when the lapping load and speed are high, and 3-body abrasion at low lapping load and speed. Compared with two-body abrasion, the subsurface cracks by three-body abrasion are deeper. 
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