浅析孔金属化和图形电镀生产线的管理

随着印制板朝着高密度、多层次的方向发展,对应着设备自动化程度的提高,作为印制板制造过程中的关键工序,孔金属化和图形电镀的管理也面临挑战。本文从工艺规范、工艺操作、人员团结精神和责任心的培养、工序衔接工作、工艺质量检验五方面给出建议,希望能给同行以借鉴。

Analyse of Electroless Copper and Pattern Plating Management

The develepment of high-density and multi-level PCB brings the improvement of equipment automation degree.As the key process in the PCB production,the management of electroless copper and pattern plating is facing the challenge.This article gives some suggestions from process specification,process operation,cuttivation of personal relationship and responsibility,process transition and process quality examination.