高真空环境下硅微机械陀螺品质因数的温度特性

分析了温度在高真空环境下对硅微机械陀螺品质因数的影响机理。阐述了热弹性阻尼的复频率模型和硅材料的温度特性,建立了品质因数温度特性理论模型,并对理论模型进行了仿真验证和实验验证。理论计算得到常温下品质因数的温度系数为-9.76×10-3/℃。利用ANSYS对品质因数的温度系数进行仿真分析,得到常温下品质因数温度系数的仿真值为-9.96×10-3/℃。对硅微机械陀螺进行品质因数温度实验,得到常温下品质因数的温度系数为-9.02×10-3/℃,与理论计算结果相差8.20%。实验结果表明:高真空环境下建立陀螺品质因数温度特性的理论模型可为陀螺的温度误差补偿提供理论依据,为陀螺的优化设计提供实际指导。

Temperature characteristics of quality factor of silicon micromachined gyroscope under high-vacuum environment

The influence mechanism of temperature on the quality factor of a Silicon Micromachined Gyroscope (SMG) under a high-vacuum environment was analyzed. The complex frequency model of thermoelastic damping and the temperature characteristics of silicon were presented. Then, the theoretical model of temperature characteristic of quality factor was set up, and the the simulation analysis and experimental verification were performed. The temperature coefficient of quality factor is -9.76×10^-3/℃ at a normal temperature with a theoretical calculation. The ANSYS was used to simulate the temperature coefficient of quality factor, and the simulation result is -9.96×10^-3/℃. The temperature experiment for quality factor was carried out, and the temperature coefficient of quality factor is -9.02×10^-3/℃, which is different from the theoretical calculation by 8.20%. The analytical results demonstrate that the theoretical model of temperature characteristic of quality factor in the high-vacuum environment provides theoretical basis for temperature compensation of the SMG and gives a guidance for optimization design of the SMG.