| 电沉积Zn-Ni-Sn合金工艺研究 |
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| 引用本文： | 王征,安茂忠,胡旭日,徐树民,高振国.电沉积Zn-Ni-Sn合金工艺研究[J].材料工程,2006(4):37-40,55. |
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| 作者姓名： | 王征 安茂忠 胡旭日 徐树民 高振国 |
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| 作者单位： | 哈尔滨工业大学,应用化学系,哈尔滨,150001;招远金宝电子有限公司,山东,招远,265400 |
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| 摘 要： | 采用碱性焦磷酸盐体系在电解铜箔上电镀Zn-Ni-Sn三元合金可改善铜箔表面的综合性能.通过研究主盐含量、pH值、温度、电流密度对镀层质量的影响,选择了合适的添加剂,并对其极化行为进行了研究,优化确定了电镀Zn-Ni-Sn三元合金的镀液组成和工艺条件.经过处理后的电解铜箔耐蚀性、耐热性和粘合强度等性能指标均有明显提高.
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| 关 键 词： | 电解铜箔 电镀 Zn-Ni-Sn三元合金 极化行为 |
| 文章编号： | 1001-4381（2006）04-0037-04 |
| 收稿时间： | 2005-10-09 |
| 修稿时间： | 2005-10-092006-01-29 |
Electrodeposition of Zn-Ni-Sn Alloy |
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| WANG Zheng,AN Mao-zhong,HU Xu-ri,XU Shu-min,GAO Zhen-guo.Electrodeposition of Zn-Ni-Sn Alloy[J].Journal of Materials Engineering,2006(4):37-40,55. |
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| Authors: | WANG Zheng AN Mao-zhong HU Xu-ri XU Shu-min GAO Zhen-guo |
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| Affiliation: | 1 Department of Applied Chemistry, Harbin Institute of Technology, Harbin 150001, China;2 Zhaoyuan Jinbao Electronic Co Ltd, Zhaoyuan 265400, Shandong, China |
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| Abstract: | Electroplating Zn-Ni-Sn ternary alloy on electrolyte copper foil using alkaline salt pyrophosphate solution was investigated. Effect of bath composition, pH, temperature, current density on deposit were discussed, an appropriate additive was chosen, and polarization action was studied. Bath composition and process conditions for electroplating Zn-Ni-Sn ternary alloy were optimized. After the plating, corrosion resistance, heat resistance and binding strength of electrolyte copper foil were improved. |
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| Keywords: | electrolyte copper foil electroplating Zn-Ni-Sn ternary alloy polarization action |
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