| 化学镀铜的研究进展 |
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| 引用本文： | 钟三子,冯建中,黄君涛.化学镀铜的研究进展[J].广东化工,2009,36(8):96-97,119,120. |
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| 作者姓名： | 钟三子 冯建中 黄君涛 |
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| 作者单位： | 1. 广州市金华大化学试剂有限公司,广东,广州,510280
2. 华南理工大学,南校区化学实验中心,广东,广州,510640 |
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| 摘 要： | 近年来，化学镀铜技术在电子工业、机械工业、航空航天等各行各业有着越来越广泛的应用。关于化学镀铜的机理研究和工艺路线改进等课题已成为当今材料表面处理研究领域的热点。文章介绍了化学镀铜技术的发展概况，综述了国内外近年来在化学镀铜领域所取得的一系列新的研究成果，指出了化学镀铜今后研究的重点。
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| 关 键 词： | 化学镀铜 研究进展 机理 |
Progress of Electrols Plating Copper |
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| Zhong Sanzi,Feng Jianzhong,Huang Juntao.Progress of Electrols Plating Copper[J].Guangdong Chemical Industry,2009,36(8):96-97,119,120. |
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| Authors: | Zhong Sanzi Feng Jianzhong Huang Juntao |
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| Affiliation: | Zhong Sanzi, Feng Jianzhong, Huang Juntao (1. Guangzhou Jinhuada Chemical Reagent Co., Ltd., Guangzhou 510280; 2. South China University of Technology, Guangzhou 510640, China) |
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| Abstract: | In recent years, electrolcs plating copper technologies are widespread applied in electrical, mechanical and aerospace industries. The study on the mechanism of electroles plating became a hot topic in the material science. The development of electroles plating was introduced in the paper, including a series of research conclusion and direction of development in the future. |
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| Keywords: | electroles plating copper research development mechanism |
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