| MEMS封装技术 |
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| 引用本文： | 张昱,潘武.MEMS封装技术[J].纳米技术与精密工程,2005,3(3):194-198. |
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| 作者姓名： | 张昱 潘武 |
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| 作者单位： | 重庆邮电学院微光机电系统研究所,重庆,400065 |
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| 摘 要： | MEMS封装是在微电子封装技术基础上发展起来的一项关键的MEMS技术.首先提出了MEMS封装设计的一些基本要求,包括封装等级、封装成本、环境影响、接口问题、外壳设计以及热设计等方面.在此基础上,介绍了键合技术、倒装芯片技术、多芯片封装以及3D封装等几种重要的MEMS封装技术,并给出了一个封装实例.最后进一步探讨了MEMS封装的发展趋势及研究动向.
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| 关 键 词： | 微机电系统 封装 倒装芯片封装 多芯片封装 |
| 文章编号： | 1672-6030（2005）03-0194-05 |
| 收稿时间： | 2005-07-10 |
| 修稿时间： | 2005年7月10日 |
Packaging Technology for MEMS |
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| ZHANG Yu,PAN Wu.Packaging Technology for MEMS[J].Nanotechnology and Precision Engineering,2005,3(3):194-198. |
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| Authors: | ZHANG Yu PAN Wu |
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| Abstract: | The packaging technology of MEMS is a key technique for MEMS based on microelectronics packaging. In this paper, some basic requirements of MEMS packaging design, such as the scale, cost, environment influences, interface of the package, design of crust and heat, and so on are put forward firstly; and then some important technologies of MEMS packaging are introduced, including bonding technology, flip-chip packaging, multi-chip packaging and 3D packaging. An example of MEMS device packaging is given. Finally, the trends of development and research for MEMS packaging are discussed. |
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| Keywords: | micro electro-mechanical systems packaging flip-chip packaging multi-chip packaging |
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