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Measurement of the adhesion and removal forces of submicrometer particles on silicon substrates
Abstract:In this study, the magnitude of the applied removal force and its relationship to the theoretical adhesion force is determined. The removal is done through the application of known hydrodynamic drag and lift forces on submicrometer particles. The hydrodynamic removal forces are then correlated with the removal percentage and the adhesion forces. A useful correlation that can be used to determine the adhesion force from the known applied removal force and the removal percentage is presented. Below 90% removal, the data indicate a linear relationship between the removal force and the removal percentage. The effects of time on the adhesion force and particle deformation are also presented.
Keywords:Adhesion force  contamination  deformation  deposition  particles  removal force  Saffman lift  shear stress
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