Conductive filament formation in printed circuit boards: effects of reflow conditions and flame retardants |
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Authors: | Bhanu Sood Michael Pecht |
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Affiliation: | (1) Center for Advanced Life Cycle Engineering (CALCE), University of Maryland, Room 0128, Martin Hall (Building 88), College Park, MD 20742, USA;(2) Center for Advanced Life Cycle Engineering (CALCE), University of Maryland, Room 1103, Engineering Lab Building, College Park, MD 20742, USA |
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Abstract: | Conductive filament formation, a major cause of failures in printed circuit boards, is an electrochemical process that involves
the transport of a metal through or across a nonmetallic medium under the influence of an applied electric field. With an
increasing potential to market “green” electronics, environmental and health legislations, and the advent of lead-free and
halogen-free initiatives, newer types of printed circuit board materials are being exposed to ever higher temperatures during
solder assembly. The higher temperatures can weaken the glass-fiber bonding, thus enhancing conductive filament formation.
The effects of the inclusion of halogen-free flame retardants on conductive filament formation in printed circuit boards are
not completely understood. Previous studies, along with analysis and examinations conducted on printed circuit boards with
failure sites that were due to conductive filament formation, have shown that the conductive path is typically formed along
the delaminated fiber glass and epoxy resin interfaces. This paper is a result of a year-long study on the effects of reflow
temperatures, halogen-free flame retardants, glass reinforcement weave style, and conductor spacing on times to failure due
to conductive filament formation. |
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