CuW/Cu整体触头气孔缺陷的消除

研制了CuW/Cu整体触头的加工工艺,同时探讨改善熔渗质量、消除熔渗气孔的方法,并对采用不同工艺制造CuW/Cu整体触头在性能和显微组织上作了对比分析。结果表明:采用氢气保护熔渗,并真空除气工艺研制的CuW/Cu整体触头密度达到理论密度的99％～100％,硬度、电阻率达到和超过国外相关标准规定的技术指标。在空气断路器、SF_6断路器上得到使用,能满足使用要求。

Removal of air hole lacuna of CuW/Cu electrical contacts

The process of the CuW/Cu integral electrical contacts and the methods on how to improve the quality of the infiltration and remove the air hole lacuna was studied and discussed, A comparative analysis was made on capability and micro-texture of different CuW/Cu electrical contacts which were made by different processes. It turned out that the density of the CuW/Cu series made by infiltration process, protect hydrogen gas and vacuum treatment reaches 99% - 100% of the Cu-W theoretic density, and electric resistance and hardness reaches and even over the technical standard at home and abroad. It can sustain the make-and-break tests and electrical lifetimes in the air circuit breakers and SF6 breakers.