Deposition of thick TiAlN coatings on 2024 Al/SiCp substrate by Arc ion plating |
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Authors: | Sheng-Sheng Zhao |
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Affiliation: | Division of Surface Engineering of Materials, Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016, PR China |
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Abstract: | Aluminum-matrix composites with particulate SiC ceramic reinforcements (Al/SiCp) have received much attention for space and aircraft propulsion applications. It is imperative to deposit thick hard coatings on these composites for protection. TiAlN coatings with a Ti interlayer were deposited by arc ion plating (AIP) on 2024 Al/SiCp substrates at various nitrogen flow rates. It was found that when the nitrogen flow rate is increased from 100 sccm to 250 sccm, the deposition rate decreases, the coating hardness increases and the adhesion strength decreases. Based on the above results and the principle of gradient materials, the thick gradient TiAlN coatings with a Ti interlayer were successfully deposited on a 2024 Al/SiCp substrate to a thickness of 60 μm by continuously increasing the nitrogen flow rate during deposition. Such an achievement can be attributed to the gradient distribution of elements, hardness, and stresses across the coating thickness. |
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Keywords: | Gradient TiAlN coating Al/SiCp substrate Arc ion plating Nitrogen flow rate |
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