Formation of oxidation-resistant Cu-Mg coatings on (001) Cu for oxide superconducting tapes |
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Authors: | KH Kim DP Norton DK Christen |
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Affiliation: | a University of Florida, Dept. of Materials Science and Engr., Gainesville, FL 32611, United States b Oak Ridge National Laboratory, Materials Science and Technology Division, Oak Ridge, TN 37831, United States |
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Abstract: | The formation of oxidation-resistant buffer layers on (001) oriented Cu for coated high-temperature superconducting tape applications was investigated. The approach employed Cu/Mg multilayer precursor films that were subsequently annealed to form either Mg-doped fcc Cu or intermetallic Cu2 Mg. The precursor consisted of an Mg/Cu multilayer stack with 5 each of 25 nm thick Mg and 25 nm thick Cu layers which were grown at room temperature by sputter deposition. At annealing temperature of 400 °C, formation of the intermetallic Cu2 Mg was observed. X-ray diffraction showed that the Cu2 Mg (100) oriented grains were epitaxial with respect to the underlying Cu film, possessing a cube-on-cube orientation. In order to test oxidation resistance, CeO2 films were deposited at elevated temperature on Ni/(Cu,Mg)/Cu/MgO structures. In case of the CeO2 film on Ni/Cu/MgO, significant surface roughness due to the metal oxidation is observed. In contrast, no surface roughness is observed in the SEM images for the CeO2/Ni/(Cu,Mg)/Cu/MgO structure. |
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Keywords: | 81 05 Bx 81 15 -z 81 65 -b 74 78 Bz 84 71 Mn |
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