| 氧化对含稀土无铅钎料表面锡须生长的影响 |
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| 引用本文： | 叶焕,薛松柏,龙伟民,张青科,马佳.氧化对含稀土无铅钎料表面锡须生长的影响[J].焊接学报,2013,34(5):59-61,66. |
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| 作者姓名： | 叶焕 薛松柏 龙伟民 张青科 马佳 |
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| 作者单位： | 1. 南京航空航天大学材料科学与技术学院,南京,210016
2. 新型钎焊材料与技术国家重点实验室郑州机械研究所,郑州,450001 |
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| 基金项目： | 南京航空航天大学博士学位论文创新与创优基金资助项目，江苏省普通高校研究生科研创新计划资助项目，新型钎焊材料与技术国家重点实验室开放课题基金资助项目 |
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| 摘 要： | 通过环境试验(室温、湿热和"无氧"试验)和扫描电镜组织分析对比研究了相同时效时间(30天)、三种不同氧化条件下锡须在Sn-Zn-Ga-Pr无铅钎料表面的生长行为.发现在室温环境下,锡须呈典型的针状生长;在湿热条件下,锡须呈丘状生长;而在氮气氛围的近似无氧条件下仅发现有少量锡粒在稀土相PrSn3表面产生.基于稀土相氧化驱动锡须生长理论,分析认为三种环境条件下锡须生长行为的不同是由于稀土相氧化程度不同造成的.湿热条件下稀土相快速氧化和腐蚀,从而比在室温和"无氧"条件下产生更多的压应力和活性Sn原子,为丘状锡须的生长提供了条件;而在氮气氛围下,稀土相氧化非常缓慢,驱动力和锡源都较少,因而只有少量短锡须和锡粒生长.
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| 关 键 词： | 无铅钎料 稀土元素 锡须 氧化 |
| 收稿时间： | 2013/1/25 0:00:00 |
Effect of oxidation on whisker growth in RE-containing lead-free solder |
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| YE Huan,XUE Songbai,LONG Weimin,ZHANG Qingke and MA Jia.Effect of oxidation on whisker growth in RE-containing lead-free solder[J].Transactions of The China Welding Institution,2013,34(5):59-61,66. |
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| Authors: | YE Huan XUE Songbai LONG Weimin ZHANG Qingke and MA Jia |
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| Affiliation: | 1. College of Materials Science and Technology,Nanjing University of Aeronautics and Astronautics,Nanjing 210016,China; 2. State Key Laboratory of Advanced Brazing Filler Metals & Technology,Zhengzhou Research Institute of Mechanical Engineering,Zhengzhou 450001, China) |
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| Abstract: | Behaviors of Sn whisker growth in Sn-Zn-Ga-Pr lead-free solder under different oxidation conditions for the same aging period (30 days) were investigated by environmental testing (room ambiance,temperature humidity and oxidation-free tests) and microstructure evaluation. It was found that the whiskers grew in hillock-type morphology under temperature humidity and in nodule-type under N2 atmosphere while the typical needle-like whisker grew in room ambience. It was discussed that the difference in whisker growth under different aging conditions is attributed to the different oxidation of rare earth (RE)-rich phase. The RE-rich PrSn3 phase experienced rapid oxidation and corrosion under temperature humidity,which led to higher driving force and more Sn sources to ensure hillock growth than that under ambient condition while the slow oxidation of PrSn3 led to lower driving force and less Sn atoms under N2 atmosphere. |
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| Keywords: | lead-free solder rare earth Sn whisker oxidation |
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