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TiSi2的形成及其在浅结多晶硅发射极工艺中的应用
引用本文:孙微风. TiSi2的形成及其在浅结多晶硅发射极工艺中的应用[J]. 微电子学, 1995, 25(5): 4-7
作者姓名:孙微风
作者单位:电子工业部第24研究所
摘    要:采用蒸发淀积、快速热退火等技术,通过Ti/Si,Ti多晶硅固相反应,形成高电导均匀的TiSi2薄膜,并将这种钛硅化物形成技术应用于浅结多晶硅发射极工艺中,自对准形成钛硅化物薄膜,以形成良好的欧姆接触减小器件互连线电阻。本文介绍了钛与单晶硅、多晶硅形成的硅化物及其在浅结多晶硅发射极工艺中的应用研究。

关 键 词:难熔金属硅化物 多晶硅 发射极工艺 快速热退火

The Formation of TiSi_2 and Its Application to Shallow Junction Poly-Si Emitter Process
Sun Weifeng. The Formation of TiSi_2 and Its Application to Shallow Junction Poly-Si Emitter Process[J]. Microelectronics, 1995, 25(5): 4-7
Authors:Sun Weifeng
Abstract:Silicides formed with Ti and single/poly silicon are investigated,and their applications to shallow junction polysilicon emitter process are examined in the paper.In our experiment,TiSi_2 films with uniform high conductivity are formed through the solid-phase reaction of Ti/Si and Ti/poly -Si using evaporating deposition, rapid thermal annealing(RTA)and other techniques.The self -aligned TiSi_2 film obtained greatly improves ohm-contact and reduces interconnect resistance of the device ,thus enhancing the performance of the transistor.
Keywords:Refractory metal silicide  Polysilicon emitter process  RTA
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