|
|||||
|
|
A physics-based electromigration reliability model for interconnects lifetime prediction |
|
| Authors: | Linlin CAI Wangyong CHEN Jinfeng KANG Gang DU Xiaoyan LIU Xing ZHANG |
| Abstract: | Dear editor,When the technology node scales down to 14 nm,the back-end-of-line (BEOL) in IC design faces the more serious chal-lenges[1,2].The high-density int... |
| Keywords: | |