| 掩膜光刻法制备柔性抗蚀电子纸微杯及其性能表征 |
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| 引用本文： | 王健,孟宪伟,唐芳琼,任湘菱,任俊,张琳.掩膜光刻法制备柔性抗蚀电子纸微杯及其性能表征[J].过程工程学报,2009,9(4):813-818. |
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| 作者姓名： | 王健 孟宪伟 唐芳琼 任湘菱 任俊 张琳 |
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| 作者单位： | 中国科学院理化技术研究所 纳米材料可控制备与应用研究室 中国科学院理化技术研究所 中国科学院理化技术研究所 中国科学院理化技术研究所 中国科学院理化技术研究所 中国科学院理化技术研究所 |
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| 基金项目： | 国家自然科学基金资助项目(编号:60736001):国家高技术研究发展计划(863)基金资助项目 |
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| 摘 要： | 采用液相光刻法，以光聚合材料体系制备了高性能电子纸微杯，研究了所用材料结构与性能的关系，并对其性能进行表征. 采用丙烯酸酯材料，以含羧酸的低聚物交联所得的网状结构为抗蚀单元，以聚酯、聚氨酯、异冰片酯单元等为柔性附着力促进单元，通过掩膜光刻法制得微杯结构. 经测定该结构在100℃下对四氯乙烯强溶剂抗蚀气密性好，铅笔硬度为3H，卷曲直径为2~3 mm，对导电聚酯基材T剥离强度(均值)达0.50 N/mm，划格附着力达0级，适用于玻璃、聚酯基材上四氯乙烯为电泳介质的微杯电泳显示．
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| 关 键 词： | 掩膜光刻 柔性 抗蚀性 电子纸 微杯 |
| 收稿时间： | 2009-2-17 |
| 修稿时间： | 2009-5-11 |
Fabrication and Characterization of General Microcups with Flexibility and Solvent-resistance by UV Photo-mask Lithography |
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| WANG Jian,MENG Xian-wei,TANG Fang-qiong,REN Xiang-ling,REN Jun,ZHANG Lin.Fabrication and Characterization of General Microcups with Flexibility and Solvent-resistance by UV Photo-mask Lithography[J].Chinese Journal of Process Engineering,2009,9(4):813-818. |
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| Authors: | WANG Jian MENG Xian-wei TANG Fang-qiong REN Xiang-ling REN Jun ZHANG Lin |
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| Affiliation: | Laboratory of Controllable Preparation and Application of Nanomaterials, Technical Institute of Physics and Chemistry, Chinese Academy of Sciences Technical Institute of Physics and Chemistry Technical Institute of Physics and Chemistry, Chinese Academy of Sciences Technical Institute of Physics and Chemistry Technical Institute of Physics and Chemistry, Chinese Academy of Sciences |
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| Abstract: | To develop a simple low-cost method for general microcups of electronic paper,the chosen methacrylic ester formulation consisted of some function units,such as solvent-resistance units,flexibility and adhesion promoting units,was accomplished through photo-mask lithography.The solvent-resistance units were the compact network structure obtained by crosslinked oligomers with carboxylic acid.Furthermore,the flexibility and adhesion promoting units were flexible materials obtained by polyester,urethane,isoborn... |
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| Keywords: | photo-mask lithography flexibility solvent resistance microcup electronic paper |
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