Evolution of Intermetallic Compounds between Sn-0.3Ag-0.7Cu Low-silver Lead-free Solder and Cu Substrate during Thermal Aging |
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| Authors: | Niwat Mookam and Kannachai Kanlayasiri |
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| Affiliation: | 1) Department of Industrial Engineering Technology, Rajamangala University of Technology Rattanakosin Wang Klai Kangwon Campus, Prachuapkhirikhan 77110, Thailand 2) Department of Industrial Engineering, King Mongkut s Institute of Technology, Ladkrabang, Bangkok 10520, Thailand |
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| Abstract: | The growth, transformation, and lattice structure of intermetallic compounds formed between Sn–0.3Ag–0.7Cu lead-free solder and copper substrate were investigated. Dip soldering was used to initiate the reaction between the solder and substrate. An η-Cu6Sn5 intermetallic phase possessing a hexagonal lattice structure was found at the as-soldered interface. Thermal aging at a number of conditions resulted in the formation of a Cu3 Sn intermetallic phase between the Cu6Sn5 layer and the copper substrate. ε-Cu3 Sn with an orthorhombic lattice structure was found together with hexagonal Cu3 Sn. Subsequently, the activation energies of the intermetallic phases were calculated and compared to results obtained from the literature. The comparison showed that good agreement existed between the findings from this study and literature data within a similar temperature range. |
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| Keywords: | Soldering Intermetallics Microstructures Activation energy |
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