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Hot-wire chemical vapor deposition and characterization of polycrystalline silicon thin films using a two-step growth method
Authors:Hsin-Yuan Mao  Dong-Sing Wuu  Bing-Rui Wu  Shih-Yung Lo  Ray-Hua Horng
Affiliation:1. Department of Materials Science and Engineering, National Chung Hsing University, 250 Kuo Kuang Road, Taichung 40227, Taiwan, Republic of China;2. Center for Advanced Industry Technology and Precision Processing, National Chung Hsing University, Taichung 40227, Taiwan, Republic of China;3. Department of Electro-Optical Engineering, National Cheng Kung University, Tainan 70101, Taiwan, Republic of China
Abstract:A two-step growth method was proposed to reduce the amorphous incubation layer in the initial growth of polycrystalline silicon (poly-Si) films prepared by hot-wire chemical vapor deposition (HWCVD). In the two-step growth process, a thin seed layer was first grown on the glass substrate under high hydrogen dilution ratios (φ ≥ 0.9), and then a thick overlayer was subsequently deposited upon the seed layer at a lower φ value. The effect of various deposition parameters on the structural properties of poly-Si films was investigated by Raman spectroscopy and transmission electron microscopy. Moreover, the electrical properties, such as dark and photo conductivities, of poly-Si films were also measured. It was found that the Si incubation layer could be suppressed greatly in the initial growth of poly-Si with the two-step growth method. In the subsequent poly-Si film thickening, a lower φ value of the reactant gases can be applied to enhance the deposition rate. Therefore, a high-quality poly-Si film can be fabricated via a two-step growth method with a sufficient growth rate using HWCVD.
Keywords:Thin films  Chemical vapor deposition  Electron microscopy  Electrical conductivity
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