| 电子器件用中温钎料的研究进展 |
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| 引用本文： | 刘志高,杨建,丘泰. 电子器件用中温钎料的研究进展[J]. 电子元件与材料, 2008, 27(6): 37-40 |
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| 作者姓名： | 刘志高 杨建 丘泰 |
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| 作者单位： | 南京工业大学,材料科学与工程学院,江苏,南京,210009;南京工业大学,材料科学与工程学院,江苏,南京,210009;南京工业大学,材料科学与工程学院,江苏,南京,210009 |
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| 摘 要： | 从中温钎料的基本性能要求出发,综述了中温(400~600℃)钎料的发展历程和近年来中温钎料的最新研究进展。指出由超细焊粉制备的焊膏是今后中温钎料发展的一个重要方向。
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| 关 键 词： | 电子技术 中温钎料 综述 焊接 电子器件 |
| 文章编号： | 1001-2028(2008)06-0037-04 |
| 修稿时间： | 2008-02-22 |
Research progress of intermediate temperature solder for electronic device |
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| LIU Zhi-gao,YANG Jian,QIU Tai. Research progress of intermediate temperature solder for electronic device[J]. Electronic Components & Materials, 2008, 27(6): 37-40 |
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| Authors: | LIU Zhi-gao YANG Jian QIU Tai |
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| Affiliation: | LIU Zhi-gao,YANG Jian,QIU Tai(College of Materials Science , Engineering,Nanjing University of Technology,Nanjing 210009,China) |
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| Abstract: | Based on the basic properties of requirements of the intermediate temperature(400~600 ℃) solder,the development history and the lastest research progress were reviewed and pointed out that the soldering paste prepared from ultrafine soldering powder is a important orientation of intermediate temperature solder in the future. |
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| Keywords: | electron technology intermediate temperature solder review soldering electronic device |
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